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性能对比
| 名称 | HiSilicon Kirin 20 | Haydn based on Qualcomm Technologies, Inc SM8350 |
|---|---|---|
| 性能排名 | 第2500名 | 第2477名 |
| 得分 | 4,544 | 4,609 |
| TDP | - | - |
| TDP Down | - | - |
| 插槽类型 | Unknown | Unknown |
| 核心数 | 8 | 8 |
| 线程数 | 8 | 8 |
| 主频 | 2.5 GHz | 2.8 GHz |
| 睿频 | - | - |
| 发布时间 | Q4 2025 | Q2 2021 |
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